Presentation - 3D PLUS
Its portfolio of patented and very advanced stacking technologies starts with Package scale upward to chip-size and wafer-level packaging techniques and provides leading edge, highly integrated and rugged modules embedding Active, Passive, Opto-electronics and MEMS/MOEMS components.
With a broad range of catalogue products including memory modules, camera heads, power converters and computer modules, with its very miniaturized System-In-Package (SIP) solutions and by Licensing its technologies, 3D PLUS meets the requirements of high technology industries in industrial, telecom., computer/blade server, military, avionics, medical and space markets.
Executives - 3D PLUS
M. Pierre Maurice
Chairman (Président)
M. Pierre-Eric Berthet
MD/Chief Operating Officer (Directeur Général)
M. Eric Mimouni
Admin/Finance Director/Manager (Directeur Financier)
Activities - 3D PLUS
Other classifications (for some countries)
NAF Rev.2 (FR 2008) : Manufacture of electronic components (2611Z)
Conventions Collectives : 2i - Convention collective nationale de la métallurgie (3248)
NACE Rev.2 (EU 2008) : Manufacture of electronic components (2611)
ISIC 4 (WORLD) : Manufacture of electronic components and boards (2610)
NACE Rev.2.1 (EU 2025) : Manufacture of electronic components (2611)
Follow us - 3D PLUS
| Discover more on our Website |
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Kompass membership
| Kompass ID? | FR0084865 |
|---|---|
| Kompass member for | + 12 years |
| Membership | Booster |
Legal information - 3D PLUS
| Type | Headquarters |
|---|---|
| Year established | 1995 |
| Legal form | SAS, société par actions simplifiée |
| Activity (NAF08) | Manufacture of electronic components (2611Z) |
| Corporate capital | 1,554,867 EUR |
| SIREN | 402 523 088 |
| SIRET (Siège) | 402 523 088 00043 |
| VAT no |
FR77 402523088 |
| No employees (address) | 100-249 Employees |
| No employees | 100-249 Employees |
Location - 3D PLUS
General Information - 3D PLUS
Certifications
| Type: | LLYOD'S ISO V.2000 |
|---|---|
| Number | 9001 |